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HPCD Powder
    发布时间: 2020-10-09 14:23    
HPCD Powder


The unique surface characteristics of Treeing HPDP deliver remarkable material removal rate with the added benefit of an excellent surface finish. 

The HPDP comes in the form of powder or slurry and is ideally suitable for LED and semiconductor materials (i.e. sapphire, SiC, silicon), metallographic applications and fine finishing. 

Due to the distinctive micro-faceted diamond surface that provides small cutting points to drastically reduce the surface roughness of the workpiece.




Specification

D10(μm)

D50(μm)

D90(μm)

2-4

≥1.90

2.7-2.9

≤4.26

2-5

≥2.22

3.1-3.3

≤4.62

3-5

≥2.55

3.6-3.9

≤5.46

3-6

≥2.92

3.9-4.3

≤6.02

4-6

≥3.36

4.5-5.0

≤6.90

4-8

≥4.35

5.8-6.1

≤8.54

5-9

≥4.57

6.1-6.4

≤8.96

5-10

≥4.97

6.5-7.4

≤10.35

8-12

≥6.75

9.0-10.5

≤14.60

12-22

≥11.35

15-17

≤23.30

15-25

≥13.30

17.5-19.3

≤26.52

20-30

≥15.20

20-23

≤31.70

25-35

≥17.45

23-26

≤36.00

30-40

≥24.25

32-36

≤49.90



[Applications]
Gem Stone, Silicon Carbide Wafer, Ceramic Parts, Watch Dial, Metallography, Sapphire Wafer, ZnSe Wafer, Metal Mold.